Taiwanese chipmaker MediaTek on January 30 hosted a ceremony to mark the start of construction of a new office building near Hsinchu High-Speed Rail Station. The 22-storey building is expected to accommodate 3,000 employees by 2027.
During the event, the company’s CEO Cai Lixing mentioned that the upcoming Dimensity 9400 chip (although he did not name it specifically) will appear in the fourth quarter of 2024. According to Cai, the new SoC will have improved artificial intelligence capabilities to compete with other high-end smartphone processors.
Although we don’t know all the details about its performance, the China Times report shed some information about the Dimensity 9400.
The leak includes a table detailing potential upgrades for the upcoming SoC, which unsurprisingly mentions the use of TSMC’s 3nm process. The move from 4nm to 3nm should lead to performance and energy efficiency improvements over its predecessor, the Dimensity 9300.
What’s more, unlike Qualcomm, which is switching to its own Oryon processor cores, MediaTek is likely to stay with the Arm processor design and switch to Cortex-X5 for its main core. In addition, the Dimensity 9400 will have three high-performance Cortex-X4 cores and four Cortex-A720 cores.
The leaked information also suggests that the Dimensity 9400 will be able to process 12 to 15 tokens (basic units of text for LLM) per second, using a special model called Llama 2 from Meta.
In addition, the Dimensity 9400 is expected to be faster than the 9300 for creating images using Stable Diffusion 1.5, taking only 3 seconds versus 3.5 seconds.
This improvement will make the Dimensity 9400 and its successor APU 790 potentially 20-50% faster at token processing and 16.7% faster at image creation.
These are still early details about the MediaTek Dimensity 9400, so we suggest you take this information with a grain of salt.