Dynatron Confirms AMD EPYC “Verano” CPU Uses SB1 Socket

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Cooling solutions manufacturer Dynatron has confirmed that AMD’s upcoming EPYC “Verano” processors, based on the “Zen 6” microarchitecture and slated for release around 2027, will utilize the new SB1 socket. This information comes as Dynatron lists its SB1-4U-ACTIVE air cooler on its website, designed specifically to support this new platform.

AMD EPYC “Verano” Targeting AI Accelerators

The EPYC “Verano” processors are engineered with a focus on AI accelerator head node applications. These processors are expected to feature up to 72 CPU cores, with clock speeds reaching up to 5GHz. A key aspect of their design is support for LPDDR5X SOCAMM2 memory modules, offering high-speed memory capabilities crucial for AI workloads.

Connectivity is another strong point for “Verano”, boasting 112Gbps high-bandwidth xGMI connections. This enhanced interconnectivity is vital for scaling performance in demanding data center environments, particularly those focused on AI and machine learning.

Dynatron’s SB1-4U-ACTIVE Cooler Details

Dynatron’s SB1-4U-ACTIVE cooler is a robust air-cooling solution designed for 4U server environments. The cooler has dimensions of 128.05 x 106.6 x 130.7 mm and features two dual-ball bearing fans, one at the front and one at the rear, to ensure efficient airflow. Internally, it incorporates a vapor chamber and multiple heat pipes to effectively dissipate heat generated by the high-performance EPYC “Verano” CPUs.

The cooling unit can reach a maximum fan speed of 6000±10% RPM, capable of delivering up to 91.7 CFM of airflow. Despite its performance, the maximum noise level is kept at 44.5 dB(A), balancing effective cooling with acoustic considerations in server deployments.

Socket SB1 and Future Implications

The introduction of the SB1 socket signifies AMD’s ongoing commitment to evolving its EPYC server platform. The “Verano” processors, with their advanced features and targeted applications, are expected to play a significant role in the burgeoning AI hardware market. The confirmation of the SB1 socket by a reputable cooling manufacturer like Dynatron adds a layer of credibility and provides concrete evidence of the platform’s development progress.

While the official launch is anticipated around 2027, the early availability of compatible cooling solutions suggests that development is on track. Server manufacturers and IT infrastructure planners can now begin to consider the SB1 platform for future deployments, especially those requiring substantial AI processing power.

Source: https://www.ithome.com/1/009/967.htm

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