Exynos 2700 Beats Snapdragon in Samsung Internal Tests

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Samsung’s upcoming Exynos 2700 processor, slated for the Galaxy S27 series early next year, has reportedly outperformed Qualcomm’s latest flagship chip in internal performance tests. This development is fueling renewed optimism for Samsung’s in-house mobile processor capabilities.

Exynos 2700 Shows Strong Performance

According to a report from Korean media outlet Financial News, Samsung’s own performance benchmarks indicate that the Exynos 2700 processor surpasses Qualcomm’s top-tier offering in both CPU and GPU capabilities. The company allegedly used a ‘Xiaomi 18 Pro Max’ for these internal benchmarking sessions.

CPU Performance Benchmarks

In Geekbench 6.5 tests, the Exynos 2700 reportedly achieved a multi-core CPU score of approximately 13,000, compared to around 11,000 for the Qualcomm chip, indicating a roughly 20% lead. The advantage for the Exynos 2700 widened to approximately 15% in Geekbench 7.0 tests. When compared against the slightly lower-tier ‘Snapdragon 8 Gen 3’, the Exynos 2700 reportedly boasted even more significant leads of 44% and 36% in these respective tests.

Graphics Performance

The Exynos 2700 also appears to hold an edge in graphics performance. In tests simulating peak performance for demanding games, the Samsung chip is said to have scored about 20% higher than its Qualcomm counterpart. For more general 3D graphics computations common in popular mobile games, the Exynos 2700 reportedly maintained a lead of approximately 5%.

Exynos Processor Lineage

The Exynos series represents Samsung Electronics’ System LSI division’s in-house developed mobile processors, responsible for core tasks such as computation and graphics processing. The previous generation, Exynos 2600, has been featured in select models of the Galaxy S26 series and the Galaxy Z Flip8.

The Exynos 2700 is expected to be manufactured using Samsung Foundry’s second-generation 2nm process technology (SF2P). Furthermore, Samsung is reportedly exploring advanced packaging techniques, such as improved heat sink encapsulation, to better manage thermal output and potentially enhance performance further.

These internal test results, if they translate to real-world performance, could mark a significant step in Samsung’s efforts to regain competitiveness in the high-end mobile processor market, challenging Qualcomm’s long-standing dominance.

Source: https://www.ithome.com/1/017/556.htm

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