Loongson Zhongke, a prominent Chinese CPU developer, announced today during its 2026 semi-annual performance briefing that it anticipates commencing shipments of logic silicon wafers for High Bandwidth Memory (HBM) production to storage manufacturers in the first half of next year.
The company’s strategic move into the HBM sector comes after an investor inquiry regarding the progress of its HBM logic silicon wafer research and development, which was initiated in collaboration with other firms on May 27th. Loongson Zhongke clarified its role in this venture, stating, “The company mainly designs logic silicon wafers; the upper-layer DRAM is from our partners.” This indicates a focused approach on the crucial logic components that enable the advanced performance of HBM.
The announcement highlights Loongson Zhongke’s commitment to expanding its technological footprint beyond traditional CPU markets into high-growth areas like advanced memory technology. The development of HBM logic silicon wafers is a significant undertaking, as HBM is critical for high-performance computing, AI accelerators, and data centers that demand massive data throughput.
Performance and Future Outlook
During the performance briefing, Loongson Zhongke reported total operating revenue of 272 million yuan in the first half of the year, marking an 11.64% year-on-year increase. However, the company posted a net loss attributable to the parent of 224 million yuan for the same period. Despite the current financial performance, the company’s forward-looking investments in cutting-edge technologies like HBM signal a strong focus on future growth and market positioning.
Broader Ecosystem Support in Storage
In response to further questions about Loongson’s involvement in the storage ecosystem, the company elaborated on its ongoing efforts and partnerships. Loongson Zhongke is actively supporting collaborators in developing solutions for distributed storage, centralized storage, and Network Attached Storage (NAS), with some of these solutions already seeing small-batch applications.
Furthermore, the company is also involved in supporting research and development for optical storage, specifically mentioning optical disk arrays. Demonstrating the breadth of its storage-related activities, Loongson Zhongke noted that storage systems based on its CPUs are already deployed in the Antarctic region, showcasing the reliability and versatility of its technology in diverse and challenging environments.
The company’s engagement across various facets of the storage market, from advanced memory components to traditional and optical storage solutions, underscores its ambition to become a comprehensive provider within the data storage and management landscape. The planned supply of HBM logic silicon wafers is expected to be a key milestone in this strategy, positioning Loongson Zhongke to capitalize on the burgeoning demand for high-performance memory technologies.
