MediaTek has unveiled its latest chipset, Dimensity 8300. The Taiwanese giant’s creation not only promises a revolutionary leap in energy efficiency and connectivity, but also introduces generative artificial intelligence capabilities that are said to change the smartphone experience in the near future. Here’s a quick look at the features and specifications that make this chipset revolutionary:
Features and specifications of the MediaTek Dimensity 8300
- Processing power: Built on TSMC’s second-generation 4nm process technology, the Dimensity 8300 boasts an octa-core processor with four Cortex-A715 cores and four Cortex-A510 cores running on Arm’s v9 processor architecture. The Mali-G615 MC6 GPU adds extra power for smooth performance.
- Generative artificial intelligence capabilities: Powered by the APU 780 AI processor, Dimensity 8300 provides full support for generative artificial intelligence. This allows developers to harness the potential of large language models of up to 10B, enabling stable distribution and innovative applications.
- Increased performance: According to MediaTek, the APU 780 shares an architecture with its flagship Dimensity 9300 chipset, which has doubled the performance of INT and FP16 computing. This means a 3.3x increase in AI performance compared to its predecessor, the Dimensity 8200.
- Mastery of image processing: Combined with the 14-bit MediaTek HDR-ISP Imagiq 980 processor, the Dimensity 8300 allows users to shoot 4K60 HDR video and enjoy advanced recording capabilities.
- Connectivity: The chipset is equipped with a 3GPP Release-16 5G modem that offers scenario-specific optimizations to improve connectivity in areas with weak signals. With 3CC carrier aggregation support, the modem achieves downlink speeds of up to 5.17 Gbps.
- Wi-Fi 6E and Bluetooth Combo: MediaTek provides a seamless transition between wireless technologies with the improved performance of Wi-Fi 6E with 160MHz bandwidth, complemented by hybrid Wi-Fi/Bluetooth coexistence technology.
Similarly, Chinese smartphone manufacturer Xiaomi has already announced that their upcoming Redmi K70e smartphone will be powered by the soon-to-be-released Dimensity 8300 chipset. The upcoming K70 series will include the K70, K70 Pro, and K70E smartphones. Redmi’s teaser confirmed the expected debut of the K70 series phones in November.
