Huawei is continuing to lift the veil on its upcoming Kirin 9050 series chipset, officially dubbed the first ‘logic folding’ τ chip. The latest details shared by the official Kirin account focus on the new generation of Lingxi CPU, highlighting its advanced capabilities and architecture.
New Lingxi CPU Architecture
The Kirin 9050 series boasts a new Lingxi CPU designed for enhanced performance and efficiency. It supports a 9-core, 16-thread hyper-threading technology. This new architecture promises significant boosts in performance, with multi-core capabilities seeing a 23% improvement, GPU rendering performance up by 40%, and NPU performance a staggering 140% increase.
When combined with HarmonyOS’s application parallelization and intelligent scheduling, users can expect a much smoother multitasking experience. The CPU’s core distribution is intelligently managed based on workload scenarios:
- Heavy-load scenarios (such as app startup, large file loading, and gaming) are handled by 1 ultra-large core and 2 performance cores.
- Multitasking scenarios (including UX interactions, floating windows, video calls, and split-screen usage) are managed by 4 efficiency cores.
- Everyday tasks (like browsing news feeds and watching short videos) are supported by 2 small cores.
Memory Compression and Power Efficiency
Beyond the core CPU enhancements, the Kirin 9050 series also introduces a memory compression accelerator. This feature significantly improves compression rates by 45%, leading to an average increase of 3GB in usable memory. This enhancement is expected to make handling multiple background applications more seamless and less demanding on device resources.
Furthermore, the chipset incorporates intelligent heterogeneous scheduling to optimize device battery life. Coupled with hardened low-latency scheduling, it ensures more efficient collaboration between various XPU (potentially referring to CPU, GPU, NPU, etc.) components.
A New Era for Kirin
At a Huawei Semiconductor business media communication meeting in October, Xu Songyu, Minister of Wireless Terminal Chip Product Management Department, stated that the Kirin 9050 series, as the first logic folding τ chip, will usher in a new journey for the next decade. According to presentation slides from the event, Huawei aims for its P-cores to exceed 5GHz frequency by 2031, indicating a long-term vision for performance scaling.
These revelations showcase Huawei’s continued commitment to advancing its in-house chip technology, positioning the Kirin 9050 series as a significant step forward in mobile processing power and efficiency.
